THERMAL PAD 100X20X1.0
Thermal pad (thermoconductive sponge) for processors |
blue 100x20x1.0mm |
Technical specifications: |
Density: 3.3 g/cm |
Hardness: 60.0+-5 Shore 00 |
Thickness: 1.0mm |
Electrical Insulation: >9 Kv/mm |
Working Temperature: -50C~+200C |
Thermal Coefficient: 6 W/m.K |
Packaging: bulk 1 pc. |